Specially developed for high precision and complex multi-die bonding process, designed with high-precision mechanical operation control platform, machine vision and algorithms. Highly modular to support flexible configuration, optimization algorithm and accurate force control to ensure bonding quality. Support dispensing, stamping, flux dipping, eutectic bonding, both face up and face down bonding, widely used in memory, industrial laser, optical communication, Lidar, CIS, MEMS, IGBT and other industries.

• High accuracy: XY placement ±5um; rotation ±0.1°
  

• Multi Chip/Die: Full-automatic for wafer change, bonding tool change, ejector change
  

• Flexible: Highly modular, convenient system maintenance and upgrade, support a variety of incoming material packaging (wafer, waffle pack, gelpack) and bonding processes (dispensing, stamping, flux dipping, eutectic bonding,both face up and face down bonding)

• High proformance: automatic calibration and inspection, continuous monitoring of machine operation, easy to use and recovery processing
  

• Reliable and stable: High reliability and stability, ensure the system long-term stable operation
  

• Programmable: Highly programmable and flexibly configure, easy to expand new functions according to differentapplication requirements
  

• Flexible communication interface: Supports a variety of communication interfaces, easy to exchange data and communicate with other devices or systems
  

Product Inquiry Hotline：+86-138-1192-8592（Mr. Mao）
Product Inquiry Email： [email protected]

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